AIT Batam Lead-Free Program

Welcome to AIT Lead-Free Program

INTRODUCTION

The infrastructure of Electronics industry has been using Leaded solder in applications for more than 5 decades. It has been commonly used due to its high reliability under different operating conditions. Leaded solder is also readily available and inexpensive. Tin Lead has a low melting point, high strength ductility, good electrical conductivity, and is well suited for general electronics application.

The basic function in Electronics interconnection:

Used to attach electronics components on printed circuit board.
Applied to component leads for compatibility with solderable surfaces.
Provides final surface finish to printed circuit boards.

Tin Lead solder (Sn Pb) a mixture of tin and lead with approximate ratio of 63/37 by weight and melts at 183 ^oC.

Legislation has been proposed to eliminate the use of Lead in Electronics manufacturing in early 1990s. Many of the major electronics manufacturers have been concerned that their ability to produce durable, reliable, safe and low cost electronics products might be compromised with the alternative solder and other interconnection materials.

In preparation for the elimination of the lead, there are ongoing studies to find a drop in replacement for lead that still would be able to match the melting temperature as well as ease of use in manufacturing. Knowledge has increased to the point that we now understand the major roadblocks in conversion to lead-free interconnection and have begun to formulate plans to address these problems.

Key issues to be addressed:

Manufacturing requirement (Melting temperature , Wettability , Reliability Performance)
Low toxicity
Cost and Availability

With these key issues and requirements to be addressed, AIT Batam has been working with several chemical and alloy suppliers to evaluate their progress in finding a drop in replacement for Lead without necessitating major changes in the process and then eliminating the roadblocks before the implementation.