FAQ & References
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Frequently Asked Questions:
Q : Which lead free finish does AIT offer? 
A : Pure Tin and Pre Plated Frames.

Q : Has it been qualified and ready for production implementation? 
A : Yes, AIT has dedicated plating machine for pure tin.

Q : What kind of whisker test does AIT perform? 
A : Please refer to Leadfree Reliability Test Plan.

Q : What countermeasures for whisker growth can AIT provide? 
A : Please refer to Whisker Mitigation Strategy.

Q : Is there any data for solderabilty of AIT’s selected lead free finish? 
A : Yes, please refer to the Summary page  

Q : Does AIT have any 2nd level evaluation? 
A : Yes, please refer to the Joint Evaluation page.

 

References:
  1. Pb-Free External Lead Finishes for Electronics Components : Tin-Bismuth and Tin- Silver (Rob Schetty, Lea Ronal Inc.)
  2. Lead Free soldering, an Analysis of the Current Status of Lead Free soldering ( BP Richards and associates), January 1999
  3. The Electrodeposition of Tin and its Alloy (Dr. Manfred Jordan)
  4. IPC Roadmap for Lead-Free Electronics Assemblies, 4th Draft June 2000
  5. European Parliament and Council Directive on Waste Electrical and Electronic Equipment, 4th draft - June 2000
  6. Japan Electronic Industry Development Association Roadmap, ver 1.2.
  7. NEMI Alloy Selection Team : Press Release, January 2000
  8. Sn-Tech technical bulletin (Lucent Technology)
  9. Slototin 40 technical bulletin (Schloetter)
  10. Harry van der Heijden (Meco Equipment Engineering - Holland)
  11. SOLDERON® Sn ST-100 technical bulletin (Shipley Ronal) 
  12. NF 2544 technical bulletin (OMG-Fidelity)
  13. Shipley Ronal Tin-Bismuth Process Presentation, October 2000
  14. Tin-Bismuth Bath VP 11-380, Schloetter 1997
  15. Slotoloy SNB 20 Technical Bulletin
  16. Lead-Free Solderable Coatings, Manfred Jordan and Roger Lawson, Schloetter 2000
 
 

© PT. AIT Batam, 2000-2004

Rev 38, Aug 2004
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