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| Objectives: |
- To further understand the reliability of
Lead-free plated component during on the board mounting.
- To define a window of process parameters to
provide good solderability of lead-free plated components.
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| Working Plan: |
- AIT will provide lead-free daisy chain
component for evaluation.
- Solectron will provide boards and paste to be
used on the evaluation.
- AIT and Solectron perform joint reliability
test to evaluate the performance.
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| Sample
Preparation: |
- AIT to provide daisy chain map and package
outline drawing of the following packages:
- SOIC: 08L, 20L
- PLCC: 100L, 176L, 208L, 256L
- PDIP: 08L, 40L
- BGA: 313, 316
- TSSOP: 48L
- Solectron will layout the test board.
Test board layout is done using:
- Leaded: 176 LQFP, 208 QFP, 44L PLCC, 48L
TSSOP, 16N SOIC
- BGA: 313, 316
- Solectron will provide boards, consist of: OSP
Entek, Immersion Tin, Nickel/Gold, and Silver finishes.
- AIT to provide active component samples,
which are plated using:
- Group 1: Ni-Pd (pre-plated frame)
- Group 2: Pure Tin
- Group 3: Other lead finish
- Tin lead plated as reference (note: lead
time is 2 weeks)
- Passive components will be supplied by other
vendor
(Note: lead time is 8 weeks)
- Solder paste to be used:
- Medium temperature: Sn-Ag-Cu (melting
point: 217 - 220 oC)
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| Test Plan: |
|
Conducted at AIT |
Conducted at Solectron |
Temperature
Cycling: -40 to 125 oC
Humidity Test: 85 oC / 85% RH
Open - Short Test
CSAM
Whisker Growth Test |
Pull Force (IC)
Shear Stress (BGA)
SIR (Surface Insulation Resistance)
ICT( In Circuit Test)
Solderability
Cross Sectioning |
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Board Layout:
 |
Evaluation
Matrix:
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AIT-Solectron
Joint Evaluation Roadmap
 |
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Evaluation Summary:
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- Pure tin finish is compatible with tin based
solder paste.
- The type of board finish, paste from different
supplier, and soldering environment (with air or N2) may
contribute to the solderability result.
- No corrosion or dendrite growth observed after
Surface Insulation Resistance Test.
- No significant difference on the joint
integrity for pure tin plated parts when soldered using lead
free solder (Sn-Ag-Cu) as compared to tin lead solder.
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