• Good electrical/mechanical and wetting properties to be able to support end customers requirement.
• No potential corrosion that will affect the long-term life of the device.
• High availability of material and cost comparable to Sn-Pb process.
• Compatible to printed circuit board application.
• Acceptable melting temperature that will not require a major change in incapsulant.

SUMMARY

• Existing Meco machine can be used with Lead-Free chemistry.
• Only plating bath will be changed for pure tin process.
• May require additional change if other alloy will be used ( Ex. Tin- Copper, Tin-Silver). The Belt stripper may need to be changed.
• Plating speed may change depending on the deposition. (Maximum Current density that can be applied).
• Lab scale test can be done to perform initial testing of the chemistry prior to manufacturing operation.
• Testing of the samples may require board assembly house involvement.
• Major chemical supplier direction is toward 100% Tin, other alloys are provided upon inquiry.
• Tin-Bismuth, Tin-SIlver, and Tin-Copper is still under evaluation as lead finish, primary concern is the alloy stability in the solution.
• Pure Tin is universally compatible with all tin based lead free solder pastes.