Pre-Plated Frame Roadmap
Phase 1
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- Identify available Pre-Plating process in Q3-99
- Evaluation of various Pre-plated lead frames using standard materials in Q4-99
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Phase 2
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- Expand evaluation on 3 Layer (2 layer NiPd with Gold Flash) in Q1-2000
- Qual Plan Set-up
- Procurement of Improved Materials for Pre-plated L/F
- Run Qualification Lots using Matrix Leadframe as a Pilot Line
- Reliability Testing Q3 -2000
- Reliability per attached test Plan
- Initial Reliability test Result - August -2000
- Review and Publish Final Results - Sept -2000
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PPF Assembly Qualification Plan
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Station
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Test
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Station
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Test
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Die Attach
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Die Shear Strength
Epoxy Thickness
Epoxy Fillet / Build-Up
Epoxy Coverage
Epoxy Bleed-Out / Outgas
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Mold
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External Visual
Internal Voids
Wire Sway
Delamination Check
Offset / Offcenter
Resin Bleed
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Wire Bond
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Ball Size
Ball Thickness
Wire Pull Strength
Wedge Pull
Ball Shear Strength
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Post Mold Cure
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Delamination Check
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Trim / Form
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Visual Inspection / Microgap
Finished Packaging Dimensional Check
Lead Fatigue
Delamination Check
Pad Tilt
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Solderability
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Test Method to be determined
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PPF Reliability Test Plan
| Test Method |
Read points |
Test Method |
Read points |
| PTH @ 121oC/100% RH |
96 hr.
168 hr.
336 hr. |
PTH with IR reflow @ 260oC/1x |
96 hrs
168 hrs
336 hrs |
| TCT @ -65 /+150oC |
500 cyc.
1000 cyc. |
TCT with IR reflow @ 220oC/3x |
500 cyc.
1000 cyc. |
| High Temp. Storage @ 150oC |
500 hr.
1000hr. |
TCT with IR reflow @ 245oC/3x |
500 cyc.
1000 cyc. |
| PTH with IR reflow @ 220oC/3x |
96 hr.
168 hr.
336 hr. |
TCT with IR reflow @ 260oC/1x |
500 cyc.
1000 cyc. |
| PTH with IR reflow @ 245oC/3x |
96 hr.
168 hr.
336 hr. |
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| Layer thickness: |
Ni : 20 - 80 µinches
Pd : 0.80 - 6 µinches
Au : 0.12 - 0.40 µinches |
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Summary of Pre-Plated Frame Evaluation
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On going evaluation:
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